SMD inspection using structured light

被引：0
|
作者：
Loh, HH
Lu, MS
机构：
来源：
PROCEEDINGS OF THE 1996 IEEE IECON - 22ND INTERNATIONAL CONFERENCE ON INDUSTRIAL ELECTRONICS, CONTROL, AND INSTRUMENTATION, VOLS 1-3 | 1996年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Computer vision technology has been widely used in on-line inspection. In this paper, we present a computer vision system using structured light which provides us with an efficient solution for solder joint inspection. Our system uses a novel inspection technology to overcome some technology bottlenecks that traditional computer vision system experienced. We focus the SMD inspection process on the solder joint defects in this paper. We developed a surface shape estimation technique for solder joint using slant map. From this technique, a solder joint can be determined to be a good (concave), bad (convex), bridged solder joint, or solder joint with surplus solder, or lacking solder.
引用
收藏
页码：1076 / 1081
页数：6
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