Microstructure and properties of high-strength Cu-Ni-Si-(Ti) alloys

被引:32
|
作者
Yang, Yi-Hai [1 ]
Li, Sheng-Yao [2 ]
Cui, Zhen-Shan [1 ]
Li, Zhou [3 ]
Li, Yun-Ping [1 ]
Lei, Qian [1 ]
机构
[1] Cent South Univ, State Key Lab Powder Met, Changsha 410083, Peoples R China
[2] Nanyang Technol Univ, Sch Phys & Math Sci, Singapore 637371, Singapore
[3] Cent South Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China
基金
中国国家自然科学基金;
关键词
Copper alloy; Microstructure; Strength; Electrical conductivity;
D O I
10.1007/s12598-020-01699-5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The tradeoff between the strength and the fracture elongation in the high-strength Cu-Ni-Si alloy became a hot research topic recently. Cu-Ni-Si-(Ti) alloys were fabricated in a vacuum induction melting furnace to study the effects of titanium on the microstructure and mechanical properties of Cu-Ni-Si alloys with different thermo-mechanical treatments. After homogenization at 900 degrees C for 4 h, hot-rolled by 80%, solution treatment at 970 degrees C for 2 h, cold-rolled by 50%, and finally aged at 450 degrees C for 180 min, the studied Cu-10Ni-Si-2Ti alloy achieved the hardness of HV 252.4, electrical conductivity of 23.6% IACS, tensile strength of 764.4 MPa, yield strength of 622.26 MPa, fracture elongation of 10.4%, and strength-elongation product of 7.95 GPa%, which are less than those of the studied Cu-10Ni-2Si alloy. The addition of Ti contributed to refining the microstructure, suppressing the decreasing trend in mechanical properties after peak hardening, and arousing a primary substructure strengthening mechanism rather than the precipitation strengthening in Cu-Ni-Si alloys. These findings provide essential understandings of the effects of the Ti on Cu-Ni-Si system alloys, and the designed Cu-Ni-Si alloys with high-strength and fracture elongation could fulfill some requirements of the electronic and electrical industry.
引用
收藏
页码:3251 / 3260
页数:10
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