Tradeoffs in selecting IC temperature sensors

被引：2
|
作者：
Moore, BD [1 ]
机构：
[1] Maxim Integrated Prod, Sunnyvale, CA 90034 USA
来源：
MICROPROCESSORS AND MICROSYSTEMS | 1999年 / 23卷 / 04期
关键词：
Current density - Electric network analysis - Electric network synthesis - Energy gap - Extrapolation - Integrated circuit layout - Microsensors;
D O I：
10.1016/S0141-9331(99)00035-6
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Integrated-circuit (IC) temperature sensors have come of age. Driven by personal computer (PC) and automotive applications, these ubiquitous heat-sniffers are embedded in almost every electronic system larger than a pager. As a result, the design and manufacture of IC temperature sensors has become a US$300 m/year industry. A survey of the IC temperature sensors available by type are presented, which provides guidelines for matching them to applications and making tradeoffs among their specifications and features.
引用
收藏
页码：181 / 184
页数：4
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