共 50 条
- [41] Action Recognition with Exemplar Based 2.5D Graph Matching COMPUTER VISION - ECCV 2012, PT IV, 2012, 7575 : 173 - 186
- [42] Assembly Challenges and Approaches for 2.5D Chiplet Based System 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 132 - 138
- [43] Prediction of hydrodynamic pressure on ships based on 2.5D theory Chuan Bo Li Xue/Journal of Ship Mechanics, 2011, 15 (1-2): : 1 - 10
- [45] An Assessment of Electromigration in 2.5D Packaging 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 2150 - 2155
- [46] 2.5D Elastic graph matching COMPUTER VISION AND IMAGE UNDERSTANDING, 2011, 115 (07) : 1062 - 1072
- [48] Pathfinding for 2.5D Interconnect Technologies 2020 ACM/IEEE INTERNATIONAL WORKSHOP ON SYSTEM LEVEL INTERCONNECT PREDICTION (SLIP), 2020,
- [50] COOL substrate for 2.5D assembly 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,