Mechanical and Fluidic Characterization of Microfluidic Interconnects for Lab-on-a-Chip Applications

被引：0

作者：

Gray, Bonnie L. ^{[1
]}

Jaffer, Seema ^{[1
]}

Sahota, Derek G. ^{[2
]}

Westwood, Stephanie M. ^{[1
]}

机构：

[1] Simon Fraser Univ, Sch Engn Sci, Microinstrumentat Lab, Burnaby, BC V5A 1S6, Canada

[2] McMaster Univ, Dept Engn Phys, Hamilton, ON, Canada

来源：

2008 IEEE 14TH INTERNATIONAL MIXED-SIGNALS, SENSORS, AND SYSTEMS TEST WORKSHOP | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present mechanical and fluidic testing apparatus and protocols that we have developed for characterizing both chip-to-chip and world-to-chip interconnects. We address the design, calibration, and limits of our testing apparatus. We also present standardized figures of merit that we have developed for comparing our interconnect structures and techniques. Finally, we address reliability issues when multiple interconnects between chips are involved.

引用

页码：160 / +

页数：2

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