Properties of the passive films present on copper and copper-nickel alloys in slightly alkaline solutions

被引：13
|
作者：
Ceré, S [1 ]
Vázquez, M [1 ]
机构：
[1] Univ Nacl Mar del Plata, Fac Ingn, INTEMA, Div Corros, Mar Del Plata, Buenos Aires, Argentina
来源：
JOURNAL OF MATERIALS SCIENCE LETTERS | 2002年 / 21卷 / 06期
关键词：
D O I：
10.1023/A:1015394909442
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The influence of Ni as an alloying element in the improvement of the corrosion resistance of copper-base alloys, using boric-borate buffer (pH=7.8) as electrolyte, was studied. Electrochemical and spectrophotometrical techniques were combined to account for the presence of cuprous oxide. When the nickel content increased and reached 30%, the composition of the film changed noticeably by the incorporation of Ni(II) compounds.
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页码：493 / 495
页数：3
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