Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

被引：1

作者：

Liao, K. -C. ^{[1
]}

Lu, H. -L. ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Bioind Mech Engn, Taipei 10617, Taiwan

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2015年 / 137卷 / 03期

关键词：

multiphysics analysis; multiscale model; contact resistance; electronic connector; ROUGH SURFACES; CONTACT; FRICTION; FLAT;

D O I：

10.1115/1.4030803

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Temperature rise could be a crucial issue for some electronic connectors subjected to the relative large electrical current. A nonstatistical multiscale sinusoidal rough surface (MSRS) model is adopted to estimate the contact area between matched metallic terminals as a function of contact load. A fast Fourier transform (FFT) is conducted to characterize the measured surface topology of the terminals. Multiphysics three-dimensional (3D) finite element analysis (FEA) is then carried out to evaluate the temperature rise of mated micro-universal serial bus (USB) connectors. Temperature distributions of the terminal based on the numerical simulations are in good agreement with those based on the measurements using a thermal couple and an infrared thermal camera as well.

引用

页数：7

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