Foreword for the Special Issue on ESD Design Challenges for High-Speed Applications

被引：0

作者：

Boselli, Gianluca ^{[1
]}

机构：

[1] Texas Instruments Inc, Dallas, TX 75243 USA

来源：

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2016年 / 16卷 / 04期

关键词：

D O I：

10.1109/TDMR.2016.2629518

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：496 / 496

页数：1

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