Foreword for the Special Issue on ESD Design Challenges for High-Speed Applications

被引：0
|
作者：
Boselli, Gianluca [1 ]
机构：
[1] Texas Instruments Inc, Dallas, TX 75243 USA
来源：
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2016年 / 16卷 / 04期
关键词：
D O I：
10.1109/TDMR.2016.2629518
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：496 / 496
页数：1
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