Crack Analysis and Node Design Improvements for Polystyrene Outer Insulation System

被引：0
|
作者：
Liu, Qishun [1 ]
机构：
[1] Zhejiang Ind Polytech Coll, Shaoxing 312000, Zhejiang, Peoples R China
来源：
ADVANCED BUILDING MATERIALS AND SUSTAINABLE ARCHITECTURE, PTS 1-4 | 2012年 / 174-177卷
关键词：
Crack Analysis; Improvement Measures; Plate Overlap; Structural Design;
D O I：
10.4028/www.scientific.net/AMM.174-177.1273
中图分类号：
TU [建筑科学];
学科分类号：
0813 ;
摘要：
As a new composite wall system, because of advanced structure, excellent polystyrene insulation board, insulation effect, light weight, the simple and flexible construction method and well adaptability, polystyrene insulation board thin coating of exterior wall thermal insulation technology is Widely used in China. In practical applications, thermal bridges and the board surface cracks that caused by improper handling of deformation joints and detailed structure are the main problem of the technology. In this paper, many problems is analyzed such as the crack causes, the plates overlap and the node structure treatment, and also corresponding solutions is proposed.
引用
收藏
页码：1273 / 1276
页数：4
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