Wafer Test Methods to Improve Semiconductor Die Reliability

被引：5
|
作者：
Mann, William R.
机构：
[1] Rockwell International, Newport Beach, CA 92663
来源：
IEEE DESIGN & TEST OF COMPUTERS | 2008年 / 25卷 / 06期
关键词：
Performance evaluation; Process control; Reliability; Reliability engineering; Robustness; Semiconductor device reliability; Testing;
D O I：
10.1109/MDT.2008.174
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Incremental advances in semiconductor device testing have improved device quality and reliability. New test methods applied to dies at the wafer level are now significantly improving the reliability of devices sold to the increasing bare-die market and reducing burn-in requirements for packaged devices.
引用
收藏
页码：528 / 537
页数：10
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