Design of Low Inductance SiC-MOS/Si-IGBT Hybrid Module for PV Inverters

被引:2
|
作者
Wang, Ye [1 ]
Chen, Min [1 ]
Xu, Dehong [1 ]
机构
[1] Zhejiang Univ, Coll Elect Engn, Hangzhou 310027, Zhejiang, Peoples R China
基金
中国国家自然科学基金;
关键词
Hybrid module; stacked bond wire substrates; parasitic inductance; inverter; POWER MODULE;
D O I
10.1109/OJPEL.2022.3224140
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, design of a low parasitic inductance T-type SiC-MOS/Si-IGBT hybrid module for PV inverters is studied. Current commutation loops and self- and mutual inductances model of the hybrid module are analyzed. Then stacked substrates structures with vertical power commutation loop to reduce parasitic inductance are identified and compared. Finally, a hybrid module with stacked bond wire substrates structure is built and test results are provided to verify the design.
引用
收藏
页码:942 / 954
页数:13
相关论文
共 50 条
  • [1] Design of Low Parasitic Inductance Three-level T-type SiC-MOS/Si-IGBT Module
    Wang, Ye
    Chen, Min
    Xu, Dehong
    2021 IEEE 12TH ENERGY CONVERSION CONGRESS AND EXPOSITION - ASIA (ECCE ASIA), 2021, : 336 - 342
  • [2] Dynamic Stability Analysis based on State-space Model and Lyapunov's Stability Criterion for SiC-MOS and Si-IGBT Switching
    Zeng, Xiao
    Li, Zehong
    Wu, Yuzhou
    Gao, Wei
    Zhang, Jinping
    Ren, Min
    Zhang, Bo
    PRODCEEDINGS OF THE 2018 IEEE 30TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2018, : 268 - 271
  • [3] Operation of a 2500 V 150 A Si-IGBT/SiC diode module
    Lendenmann, H.
    Johansson, N.
    Mou, D.
    Frischholz, M.
    Åstrand, B.
    Isberg, P.
    Ovren, C.
    Materials Science Forum, 2000, 338
  • [4] Development of 1700V Hybrid Module with Si-IGBT and SiC-SBD for High Efficiency
    Takaku, T.
    Wang, H.
    Matsuda, N.
    Igarashi, S.
    Nishimura, T.
    Miyashita, S.
    Ikawa, O.
    2015 9TH INTERNATIONAL CONFERENCE ON POWER ELECTRONICS AND ECCE ASIA (ICPE-ECCE ASIA), 2015, : 844 - 849
  • [5] Comparison of Hybrid 3.3kV Si-IGBT/SiC-Schottky and 3.3kV Si-IGBT/Si technologies
    Sharma, Y. K.
    Mumby-Croft, P.
    Ngwendson, L.
    Coulbeck, L.
    Birkett, M.
    Jiang, H.
    Wang, Y.
    Deviny, I.
    2018 20TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'18 ECCE EUROPE), 2018,
  • [6] Gate Drive Design for a Hybrid Si IGBT/SiC MOSFET Module
    Li, Lei
    Ning, Puqi
    Wen, Xuhui
    Bian, Yuanjun
    Zhang, Dong
    2018 1ST WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA), 2018, : 34 - +
  • [7] Simplified Model Analysis of Self-Excited Oscillation and Its Suppression in a High-Voltage Common Package for Si-IGBT and SiC-MOS
    Saito, Katsuaki
    Miyoshi, Tomoyuki
    Kawase, Daisuke
    Hayakawa, Seiichi
    Masuda, Toru
    Sasajima, Yasushi
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 65 (03) : 1063 - 1071
  • [8] Impact of forward recovery effects in different Si-IGBT technologies used in hybrid Si-IGBT, SiC-MOSFET based ANPC topology
    Kahraman, Civan Lezgin
    Lakshmeesha, Srikanth
    Rosado, Sebastian
    Wijekoon, Thiwanka
    2022 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, 2022, : 1364 - 1370
  • [9] Switching behavior of a hybrid Si-IGBT and SiC MOSFET based ANPC Topology
    Lakshmeesha, Srikanth
    Kahraman, Civan Lezgin
    Rosado, Sebastian
    Wijekoon, Thiwanka
    2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2021, : 293 - 298
  • [10] Analysis of gate voltage oscillation in a module with combination of Si-IGBT and SiC Schottky Diodes
    Horie, Shunta
    2018 20TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'18 ECCE EUROPE), 2018,