Continuous monitoring with a permanently installed high-resolution ultrasonic phased array

被引:8
|
作者
Sun, Xiaoyu [1 ,2 ,3 ]
Croxford, Anthony J. [1 ]
Drinkwater, Bruce W. [1 ]
机构
[1] Univ Bristol, Dept Mech Engn, Ultrason & Non Destruct Testing Grp, Univ Walk, Bristol, England
[2] Univ Bristol, Bristol Ctr Funct Nanomat, HH Wills Phys Lab, Bristol, England
[3] Univ Bristol, Dept Mech Engn, Ultrason & Non Destruct Testing Grp, Queens Bldg, Univ Walk, Bristol BS8 1TR, Avon, England
关键词
Ultrasonic arrays; non-destructive testing (NDT); structural health monitoring (SHM); long-term continuous monitoring; high-resolution ultrasonic imaging; WAFER ACTIVE SENSORS; PLACEMENT; SYSTEM;
D O I
10.1177/14759217231152413
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
High-resolution defect detection is an integral part of non-destructive testing (NDT). Ultrasonic array transducers have been developed to respond to this need and provide high-resolution images for such applications. At present, high-resolution imaging is achieved by ultrasonic array design, such as enhanced transducer materials, and optimised element geometry to fulfil inspection requirements and miniaturise imaging artefacts, etc. This paper presents a novel ultrasonic array and controller system design strategy that can miniaturise the array and reduce manufacturing cost of the entire array system. This then enables the permanent or semi-permanent installation of arrays onto structures and long-term continuous structural health monitoring (SHM). The array geometry is designed as a compromise between the required imaging performance for the desired application and the fabrication cost for permanent installation. A prototype array transducer is constructed from piezoceramic elements bonded to a flexible printed circuit (FPC) substrate and then permanently installed on example structures to demonstrate long-term monitoring. Improved long-term sensitivity to defect growth is achieved by applying a compensation strategy for velocity and phase changes with temperature. Results show that a 5 MHz, 18-element prototype array can detect changes as small as 0.1 mm in the diameter of a side-drilled hole (SDH) defect after 3 months of continuous monitoring.
引用
收藏
页码:3451 / 3464
页数:14
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