5G mmWave Patch Antenna Array on Extremely Low Loss Alumina Ribbon Ceramic Substrates for Antenna-in-Packaging (AiP)

The multi-layer capability of Corning's alumina ribbon ceramic (ARC) substrates for 5G mmWave Antenna-in-Packaging (AiP) is demonstrated on the 1x4 array antenna using three 120 mu m ARC substrates that have an extremely low dielectric loss, low profile, compactness, and good heat dissipation. The 1x4 mmWave array antenna is designed and fabricated by the laser ablation process, standard semi-additive metallization process, and Cu-Cu bonding with the Cu nitride passivation layer. The Cu nitride passivation layer allows lower process temperature and lower pressure than the conditions of direct Cu-Cu bonding. The fabricated 1x4 array antenna is characterized including a beam steering. It has a simulated and measured peak gain of 11.2 dBi and 10.8 dBi, respectively, with a simulated 3-dB beamwidth of 26.3 degrees in the H-plane and 82.1 degrees in the E-plane. The beam can be steered up to 50 degrees with 150 degrees input phase difference between antenna elements.