Vascularized 3D Cardiac tissues On-Chip

被引：0
|
作者：
Akinbote, Akinola [1 ]
Sastre, Violeta Beltran [1 ]
Haase, Kristina [1 ]
机构：
[1] European Mol Biol Labs Barcelona, Barcelona, Spain
来源：
JOURNAL OF VASCULAR RESEARCH | 2023年 / 60卷 / SUPP1期
关键词：
D O I：
暂无
中图分类号：
Q4 [生理学];
学科分类号：
071003 ;
摘要：
42
引用
收藏
页码：28 / 28
页数：1
相关论文
共 50 条
  • [31] Generation of vascularized human cardiac organoids for 3D in vitro modeling
    Voges, Holly K.
    Mills, Richard J.
    Porrello, Enzo R.
    Hudson, James E.
    STAR PROTOCOLS, 2023, 4 (03):
  • [32] Post-Maturation Reinforcement of 3D-Printed Vascularized Cardiac Tissues
    Silberman, Eric
    Oved, Hadas
    Namestnikov, Michael
    Shapira, Assaf
    Dvir, Tal
    ADVANCED MATERIALS, 2023, 35 (31)
  • [33] Latest Advances in 3D Bioprinting of Cardiac Tissues
    Jafari, Arman
    Ajji, Zineb
    Mousavi, Ali
    Naghieh, Saman
    Bencherif, Sidi A.
    Savoji, Houman
    ADVANCED MATERIALS TECHNOLOGIES, 2022, 7 (11)
  • [34] 3D bioprinted cardiac tissues for heart repair
    Gentile, Carmine
    Roche, Christopher
    Beck, Dominik
    Xue, Meilang
    TISSUE ENGINEERING PART A, 2022, 28 : 169 - 169
  • [35] New Generation 3D Printed On-Chip Energy Storage Devices
    Ying, Yang Hui
    2016 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2016, : 472 - 475
  • [36] Performance Modeling and Optimization for On-Chip Interconnects in 3D Memory Arrays
    Mohseni, Javaneh
    Pan, Chenyun
    Naeemi, Azad
    PROCEEDINGS OF THE SEVENTEENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN ISQED 2016, 2016, : 252 - 257
  • [37] A Customized Design of DRAM Controller for On-Chip 3D DRAM Stacking
    Zhang, Tao
    Wang, Kui
    Feng, Yi
    Song, Xiaodi
    Duan, Lian
    Xie, Yuan
    Cheng, Xu
    Lin, Youn-Long
    IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE 2010, 2010,
  • [38] Configurable Links for 3D Network On-Chip based on Mapping Algorithm
    Liu, Yi
    Niu, Yu-Ting
    Xu, Chang-Qing
    2016 13TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2016, : 1621 - 1623
  • [39] Impact of On-Chip Interconnects on Vertical Signal Propagation in 3D ICs
    Niioka, Nanako
    Watanabe, Masayuki
    Karel, Rosely
    Kobayashi, Tetsuya
    Imai, Masashi
    Fukase, Masa-aki
    Kurokawa, Atsushi
    2014 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS (APCCAS), 2014, : 607 - 610
  • [40] In-Situ Characterization of 3D Package Systems with On-Chip Measurements
    Oh, Dan
    Lan, Hai
    Madden, Chris
    Chang, Sam
    Yang, Ling
    Schmitt, Ralf
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1485 - 1492
12345