Enhancing Conductivity of Silver Nanowire Networks through Surface Engineering Using Bidentate Rigid Ligands

被引:4
|
作者
Liu, Wing Chung [1 ]
Prentice, Joseph C. A. [1 ]
Patrick, Christopher E. [1 ]
Watt, Andrew A. R. [1 ]
机构
[1] Univ Oxford, Dept Mat, Oxford OX1 3PH, England
基金
英国工程与自然科学研究理事会;
关键词
silver nanowires; ligand exchange; conductivefilms; flexible electronics; molecular junctions; GENERALIZED GRADIENT APPROXIMATION; NEGATIVE ELECTRON-AFFINITIES; TRANSPARENT; NANOPARTICLES; MECHANISM; FILMS; INKS;
D O I
10.1021/acsami.3c15207
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Solution processable metallic nanomaterials present a convenient way to fabricate conductive structures, which are necessary in all electronic devices. However, they tend to require post-treatments to remove the bulky ligands around them to achieve high conductivity. In this work, we present a method to formulate a post-treatment free conductive silver nanowire ink by controlling the type of ligands around the silver nanowires. We found that bidentate ligands with a rigid molecular structure were effective in improving the conductivity of the silver nanowire networks as they could maximize the number of linkages between neighboring nanowires. In addition, DFT calculations also revealed that ligands with good LUMO to silver energy alignment were more effective. Because of these reasons, fumaric acid was found to be the most effective ligand and achieved a large reduction in sheet resistance of 70% or higher depending on the nanowire network density. The concepts elucidated from this study would also be applicable to other solution processable nanomaterials systems such as quantum dots for photovoltaics or LEDs which also require good charge transport being neighboring nanoparticles.
引用
收藏
页码:4150 / 4159
页数:10
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