Transient Thermal Modeling of a Venusian Surface Thermopile Heat Flux Sensor

被引：0
|
作者：
Rivera, Kyle A. A. [1 ]
Anderson, Kevin R. R. [1 ]
Pauken, Michael T. T. [2 ]
机构：
[1] Calif State Polytech Univ Pomona, Mech Engn, Pomona, CA 91768 USA
[2] CALTECH, Jet Prop Lab, Adv Thermal Concepts & Anal, Pasadena, CA 91109 USA
来源：
JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER | 2023年 / 37卷 / 02期
关键词：
D O I：
10.2514/1.T6585
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
12
引用
收藏
页码：519 / 522
页数：4
相关论文
共 50 条
  • [21] Inverse Estimation of Transient Heat Flux to Slab Surface
    Miao Cui
    Kai Yang
    Yun-fei Liu
    Xiao-wei Gao
    Journal of Iron and Steel Research International, 2012, 19 : 13 - 18
  • [22] Inverse Estimation of Transient Heat Flux to Slab Surface
    Cui Miao
    Yang Kai
    Liu Yun-fei
    Gao Xiao-wei
    JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2012, 19 (11) : 13 - 18
  • [23] Characterizing a Transient Heat Flux Envelope for Lunar-Surface Spacesuit Thermal Control Applications
    Hager, Philipp B.
    Walter, Ulrich
    Massina, Christopher J.
    Klaus, David M.
    JOURNAL OF SPACECRAFT AND ROCKETS, 2015, 52 (04) : 1193 - 1202
  • [24] Inverse Estimation of Transient Heat Flux to Slab Surface
    CUI Miao
    JournalofIronandSteelResearch(International), 2012, 19 (11) : 13 - 18
  • [25] Development of thin film heat flux sensor based on transparent conductive oxide thermopile with antireflective coating
    Li, Xin
    Cui, ZaiFu
    Sun, Daoheng
    Chen, Qinnan
    He, Gonghan
    Liu, Baolin
    Hai, Zhenyin
    Chen, Guochun
    Jia, Zhiyuan
    Yao, Zong
    SENSOR REVIEW, 2022, 42 (04) : 428 - 439
  • [26] Transient thermal constriction resistance in a finite heat flux tube
    Orlande, H.R.B.
    Ozisik, M.N.
    Journal of Heat Transfer, 1995, 117 (03): : 748 - 751
  • [27] TRANSIENT-EFFECTS MODELING OF CRITICAL HEAT-FLUX
    CHANG, SH
    LEE, KW
    GROENEVELD, DC
    NUCLEAR ENGINEERING AND DESIGN, 1989, 113 (01) : 51 - 57
  • [28] High temperature heat flux sensor with ITO/In2O3 thermopile for extreme environment sensing
    Dong, Helei
    Lu, Meimei
    Wang, Weifeng
    Tan, Qiulin
    MICROSYSTEMS & NANOENGINEERING, 2024, 10 (01):
  • [29] Printed circuit board process based thermopile-type heat flux sensor used for monitoring chips
    Wang, D. H.
    Wang, M. Z.
    Peng, Y. H.
    Zhang, Y.
    APPLIED THERMAL ENGINEERING, 2022, 205
  • [30] Novel flexible atomic layer thermopile heat flux sensor via orientation-controlled growth technique
    Li, Zhenzhe
    Tao, Bowan
    Zhao, Ruipeng
    Yang, Kai
    Chen, Xi
    Xie, Tian
    Xia, Yudong
    Zhu, Hongxu
    Tian, Hongbo
    Yu, Yuhang
    CERAMICS INTERNATIONAL, 2024, 50 (17) : 30334 - 30344
12345