共 50 条
- [41] Comparative performances of new KNN lead-free piezoelectric materials and classical lead-based ceramics for ultrasonic transducer applications. 2003 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2, 2003, : 1995 - 1998
- [42] A compatibility evaluation of lead-based and lead-free solder alloys in conjunction with electroless nickel/immersion gold flip chip UBM 2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 575 - 580
- [45] An overview and comparison of viable lead-free alloys 2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 308 - 313
- [47] Micro-Particle Induced X-ray Emission Study of Lead-Free and Lead-Based Solders and Interactions with Copper Wires PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2023, 220 (10):
- [48] COMPARISON OF CREEP LIFE ASSESSMENT BETWEEN TIN-BASED LEAD-FREE SOLDERS AND LEAD SOLDERS CHARACTERIZATION OF MINERALS, METALS, AND MATERIALS, 2012, : 479 - 486