Effects of AgSnSe2 addition on the thermoelectric properties of Bi0.5Sb1.5Te3

被引:8
|
作者
Niu, Xin [1 ]
Lang, Yudong [3 ]
Pan, Lin [1 ,2 ]
Wang, Yifeng [1 ,2 ]
机构
[1] Nanjing Tech Univ, Coll Mat Sci & Engn, Nanjing 210009, Peoples R China
[2] Nanjing Tech Univ, Jiangsu Collaborat Innovat Ctr Adv Inorgan Funct C, Nanjing 210009, Peoples R China
[3] Nanjing Fiberglass Res & Design Inst Co Ltd, Nanjing, Peoples R China
基金
中国国家自然科学基金;
关键词
Thermoelectric; Bi0; 5Sb1; 5Te3; AgSnSe2; ZT; IONIZED IMPURITY SCATTERING; CARBON NANOTUBES; BI0.5SB1.5TE3; PERFORMANCE; DEFORMATION; DISPERSION; TRANSPORT; HEAT;
D O I
10.1016/j.jallcom.2023.170399
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In this study, the thermoelectric properties of Bi0.5Sb1.5Te3 with the addition of AgSnSe2 were investigated. It was found that the addition of AgSnSe2 significantly improved the electrical conductivity of the Bi0.5Sb1.5Te3 based sample, which was attributed to the spontaneous Ag doping and the generation of the high carrier concentration SnTe secondary phase. Due to the significant increase in a, the maximum PF increased to-39 ILW cm(-1)K(-2) at 323 K. Meanwhile, owing to the larger lattice anharmonicity by sponta-neous Ag doping and enhanced interfacial scattering of phonons by secondary phase SnTe, Kl decreases from 1.17 W m(-1) K-1 for the intrinsic sample to 0.72 W m(-1) K-1 for the x = 0.5 sample at 300 K. Thanks to the synergistic effect of AgSnSe2 addition, a larger ZT of 1.1 at 373 K is obtained in Bi0.5Sb1.5Te3-0.4% AgSnSe2, which is 1.45 times higher than that of the intrinsic sample.(c) 2023 Elsevier B.V. All rights reserved.
引用
收藏
页数:7
相关论文
共 50 条
  • [41] Effect of Grain Sizes on Thermoelectric Properties of Extruded Samples of Bi0.5Sb1.5Te3 Solution
    Barkhalov, B. Sh
    Tagiyev, M. M.
    Bagiyeva, G. Z.
    Abdinova, G. D.
    Aliyev, R. Yu
    Magerramova, K., I
    RUSSIAN PHYSICS JOURNAL, 2019, 62 (04) : 664 - 672
  • [42] Thermoelectric properties of Bi0.5Sb1.5Te3 thin films grown by pulsed laser deposition
    Symeou, E.
    Pervolaraki, M.
    Mihailescu, C. N.
    Athanasopoulos, G. I.
    Papageorgiou, Ch.
    Kyratsi, Th.
    Giapintzakis, J.
    APPLIED SURFACE SCIENCE, 2015, 336 : 138 - 142
  • [43] Preparation and thermoelectric properties of ZnTe-doped Bi0.5Sb1.5Te3 single crystal
    Qin, Cheng
    Jin, Min
    Zhang, Rulin
    Zhou, Lina
    Bai, Xudong
    Yang, Miaosen
    Li, Wen
    MATERIALS LETTERS, 2021, 292
  • [44] Response of thermoelectric parameters of Bi0.5Sb1.5Te3 films to secondary recrystallization
    Yu. A. Boykov
    V. A. Danilov
    Semiconductors, 2017, 51 : 976 - 978
  • [45] Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode
    C. L. Yang
    H. J. Lai
    J. D. Hwang
    T. H. Chuang
    Journal of Materials Engineering and Performance, 2013, 22 : 2029 - 2037
  • [46] Response of thermoelectric parameters of Bi0.5Sb1.5Te3 films to secondary recrystallization
    Boykov, Yu. A.
    Danilov, V. A.
    SEMICONDUCTORS, 2017, 51 (08) : 976 - 978
  • [47] Thermoelectric and mechanical properties of the Bi0.5Sb1.5Te3 solid solution prepared by melt spinning
    Ivanova, L. D.
    Petrova, L. I.
    Granatkina, Yu. V.
    Leontyev, V. G.
    Ivanov, A. S.
    Varlamov, S. A.
    Prilepo, Yu. P.
    Sychev, A. M.
    Chuiko, A. G.
    Bashkov, I. V.
    INORGANIC MATERIALS, 2013, 49 (02) : 120 - 126
  • [48] Thermoelectric and mechanical properties of the Bi0.5Sb1.5Te3 solid solution prepared by melt spinning
    L. D. Ivanova
    L. I. Petrova
    Yu. V. Granatkina
    V. G. Leontyev
    A. S. Ivanov
    S. A. Varlamov
    Yu. P. Prilepo
    A. M. Sychev
    A. G. Chuiko
    I. V. Bashkov
    Inorganic Materials, 2013, 49 : 120 - 126
  • [49] Correlation of Microstructural Properties with Thermoelectric Performance of Bi0.5Sb1.5Te3 Films Fabricated by Electroplating
    Koukharenko, E.
    Li, X.
    Kuleshova, J.
    Fowler, M.
    Frety, N.
    Tudor, M. J.
    Beeby, S. P.
    Nandhakumar, I
    White, N. M.
    THERMOELECTRIC MATERIALS 2010 - GROWTH, PROPERTIES, NOVEL CHARACTERIZATION METHODS AND APPLICATIONS, 2010, 1267
  • [50] Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode
    Yang, C. L.
    Lai, H. J.
    Hwang, J. D.
    Chuang, T. H.
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2013, 22 (07) : 2029 - 2037