Tuning the microstructure and mechanical properties of AlSi10Mg alloy via in-situ heat-treatments in laser powder bed fusion

被引:15
|
作者
Bosio, Federico [1 ]
Phutela, Chinmay [1 ]
Ghisi, Natalia [1 ]
Alhammadi, Alya [1 ]
Aboulkhair, Nesma T. [1 ,2 ]
机构
[1] Technol Innovat Inst TII, Adv Mat Res Ctr, Addit Mfg Grp, Abu Dhabi, U Arab Emirates
[2] Univ Nottingham, Fac Engn, Ctr Addit Mfg, Nottingham NG8 1BB, England
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2023年 / 879卷
关键词
In -situ heat -treatments; Aluminium alloys; Build plate heating; Printing time; Laser powder bed fusion; Additive manufacturing; MELTED ALSI10MG; MANUFACTURED ALSI10MG; TENSILE PROPERTIES; AL-12SI ALLOY; STRENGTH; PARTS; FATIGUE; TEMPERATURE; PARAMETERS; HYDROGEN;
D O I
10.1016/j.msea.2023.145268
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Together, advanced technologies and metallic materials rapidly progress in the field of Laser Powder Bed Fusion (PBF-LB) additive manufacturing (AM). Although PBF-LB drastically shortens the design-to-manufacture time, post-processing operations on metal parts, including heat-treatments, are often labour intensive and timeconsuming. Therefore, we assess the feasibility of conductingin-situ heat-treatments during PBF-LB of AlSi10Mg parts. A build plate heated at set temperatures up to 500 & DEG;C was employed while printing for 10-13 h to tune the material's microstructure. For comparison, a batch of samples was printed at 220 & DEG;C and 500 & DEG;C with a printing time of 4-6 h, which was subsequently solution heat-treated. The experimental results showed that increasing the printing time from 5 h to 11 h while printing at 220 & DEG;C resulted in an in-situ direct aging heattreatment with an actual increment of hardness and strength. Printing at 300 & DEG;C induced a significant Al lattice relaxation and consequent in-situ stress relieving of the as-built parts. Lastly, the study shows that in-situsolution heat-treatment is possible when using build plate temperatures between 450 & DEG;C and 500 & DEG;C for 11 h, although a reduction in ductility (-36%) occurs, as compared to conventionally solution heat-treated counterparts.
引用
收藏
页数:19
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