Analysis of Innovative 3D-Printed Direct Coolers for Modular Power Devices

被引：1
|
作者：
Delmonte, Nicola [1 ]
Cova, Paolo [1 ]
Spaggiari, Davide [1 ]
Santoro, Danilo [1 ]
Sciancalepore, Corrado [1 ]
Menozzi, Roberto [1 ]
机构：
[1] Univ Parma, Dept Engn & Architecture, Parma, Italy
来源：
2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC | 2023年
关键词：
Cold plate; 3D printing; cooling; heat sinks; computational fluid dynamics (CFD); jet impingement cooling;
D O I：
10.1109/THERMINIC60375.2023.10325915
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
This work focuses on innovative coolers for power semiconductor modules. The jet-impingement technique is used for direct device cooling with custom 3D-printed cooler structures. The paper presents a solution for power modules with dissipated power density up to 20 W/cm 2. The coolers were designed using the Finite Element Method (FEM), which allows to evaluate both the thermal and hydraulic performance, and to identifying the optimal geometry. Experimental results of a 3D printed prototype are also presented, showing god agreement with the FEM simulations.
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页数：4
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