200-330-GHz Substrate-Integrated Waveguide in BEOL of a SiGe BiCMOS Process

被引:2
|
作者
Bhutani, Akanksha [1 ,2 ]
Kaynak, Mehmet [2 ,3 ]
Bekker, Elizabeth [1 ,2 ]
Zwick, Thomas [1 ,2 ]
机构
[1] Karlsruhe Inst Technol, Inst Radio Frequency Engn & Elect, D-76131 Karlsruhe, Germany
[2] Texas Instruments Inc, Kilby Labs, Dallas, TX 75243 USA
[3] IHP Technol, D-15236 Frankfurt, Germany
来源
IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS | 2023年 / 33卷 / 09期
关键词
Backend-of-line (BEOL); millimeter-wave (mmW); SiGe BiCMOS process; substrate-integrated waveguide (SIW); IN-PACKAGE; ANTENNA; CHIP; GHZ;
D O I
10.1109/LMWT.2023.3283304
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter shows the first 200-330-GHz substrate-integrated waveguide (SIW) to a grounded coplanar waveguide (GCPW) transition realized in backend-of-line (BEOL) of a SiGe BiCMOS process. The transition uses two rectangular slots and a GCPW stub, which convert a quasi-TE10 to quasi-TEM mode with the highest operating frequency of up to 330 GHz, largest operation bandwidth of 49%, and smallest transition length of 99 mu m for a silicon process-based SIW transition demonstrated to date. A back-to-back configuration with ground-signal-ground (GSG) pads on either end enables probe-based S-parameter measurement. The influence of the GSG pads is de-embedded by measuring a 50-Omega GCPW connected by a pair of the GSG pads. A comparison of the measured and de-embedded S-parameters with the electromagnetic simulation results show that the SIW-GCPW transition operates from 200 to 330 GHz (49% bandwidth) with an average insertion loss of approximate to 1.2 dB per transition.
引用
收藏
页码:1258 / 1261
页数:4
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