Curing Reaction Kinetics of Epoxy Resin Using Dicyandiamide Modified by Aromatic Amines

被引：6
|
作者：
CHEN Lianxi1
2. School of Materials Science and Engineering
机构：
来源：
Wuhan University Journal of Natural Sciences | 2007年 / 06期
基金：
国家高技术研究发展计划(863计划);
关键词：
modified dicyandiamide; aromatic amine; epoxy resin; kinetics;
D O I：
暂无
中图分类号：
O621.2 [有机化合物性质];
学科分类号：
070303 ; 081704 ;
摘要：
The curing reaction and reaction mechanism of epoxy resin E-44, for which aromatic amine modified dicyandiamide was used as a curing reagent, were investigated by means of differen-tial scanning calorimetry (DSC). The results showed that the modified dicyandiamide had better curing characteristic than un-modified dicyandiamide for epoxy resin E-44, and the curing reac-tion could be carried out at moderate temperature. Apparent acti-vation energy of the curing reaction was decreased appreciably from 123.829 kJ/mol to 61.550-64.405 kJ/mol, and reaction order was decreased from 0.941 to 0.896-0.900. Curing reaction mecha-nism also was discussed.
引用
收藏
页码：1105 / 1108
页数：4
相关论文
共 50 条
  • [31] Curing kinetics of epoxy resin for RFI process using isothermal DSC
    College of Aerospace and Materials Engineering, National University of Defense Technology, Changsha 410073, China
    Fuhe Cailiao Xuebao, 2008, 4 (18-23):
  • [32] Curing of epoxy resins with dicyandiamide. Reaction behaviour of glycidyl ethers
    Fedtke, M., 1600, (23):
  • [33] CURING OF EPOXY-RESINS WITH DICYANDIAMIDE - REACTION BEHAVIOR OF GLYCIDYL ETHERS
    FEDTKE, M
    DOMARATIUS, F
    PFITZMANN, A
    POLYMER BULLETIN, 1990, 23 (04) : 381 - 388
  • [34] HEAT OF REACTION AND CURING OF EPOXY-RESIN
    CHANG, SS
    JOURNAL OF THERMAL ANALYSIS, 1988, 34 (01): : 135 - 154
  • [35] Photogeneration of polyfunctional amines and novel thermal curing reactions of epoxy resin and polyurethane oligomer using these amines
    Nishikubo, Tadatomi
    Takehara, Eiji
    Kameyama, Atsushi
    1600, (31):
  • [36] Curing Behavior, Kinetics and Thermal Properties of o-Cresol Formaldehyde Epoxy Resin Modified by Liquid Crystalline Epoxy Resin
    Gao, Jungang
    Zhang, Xiaona
    Huo, Li
    INTERNATIONAL JOURNAL OF POLYMERIC MATERIALS, 2008, 57 (10) : 925 - 939
  • [37] Influence of surface modified graphene oxide on the mechanical performance and curing kinetics of epoxy resin
    Li, Lu
    Liao, Xia
    Sheng, Xingyue
    Liu, Pan
    Hao, Zengheng
    He, Leilei
    Qin, Geng
    POLYMERS FOR ADVANCED TECHNOLOGIES, 2020, 31 (08) : 1865 - 1874
  • [38] Curing and Degradation Kinetics of Phosphorus-Modified Eugenol-Based Epoxy Resin
    Matykiewicz, Danuta
    Dudziec, Beata
    ACS OMEGA, 2025, 10 (05): : 4353 - 4366
  • [39] Curing kinetics and mechanism of TDE-85/MeTHPA epoxy resin modified by polyurethane
    Li, Zhi-Hua
    Ren, Dong-Yan
    Zheng, Zi-Qiao
    Li, Bo
    Qiangjiguang Yu Lizishu/High Power Laser and Particle Beams, 2007, 19 (04): : 616 - 620
  • [40] Curing Kinetics of DGEBA Epoxy Resin Modified by Poly (phthalazinone ether ketone) (PPEK)
    Xu, Yajuan
    Zhou, Sikai
    Liao, Gongxiong
    Jian, Xigao
    POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING, 2012, 51 (02) : 128 - 133
12345