Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms

被引:0
|
作者
Wenbo Pang [1 ,2 ]
Xu Cheng [1 ,2 ]
Haojie Zhao [3 ]
Xiaogang Guo [1 ,2 ]
Ziyao Ji [1 ,2 ]
Guorui Li [4 ]
Yiming Liang [4 ]
Zhaoguo Xue [1 ,2 ]
Honglie Song [1 ,2 ]
Fan Zhang [1 ,2 ]
Zheng Xu [1 ,2 ,5 ]
Lei Sang [3 ]
Wen Huang [3 ]
Tiefeng Li [6 ]
Yihui Zhang [1 ,2 ]
机构
[1] Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University
[2] Center for Flexible Electronics Technology, Tsinghua University
[3] School of Microelectronics, Soft Membrane Electronic Technology Laboratory, Hefei University of Technology
[4] Zhejiang Lab
[5] State Key Laboratory for Manufacturing and Systems Engineering, School of Mechanical Engineering, Xi'an Jiaotong University
[6] Center for X-Mechanics, Zhejiang University
基金
中国国家自然科学基金;
关键词
3D assembly; buckling; reconfigurable structures; dielectric elastomers; reconfigurable RF circuits;
D O I
暂无
中图分类号
TH-39 [机电一体化];
学科分类号
080202 ; 080401 ; 080805 ; 0811 ;
摘要
The manufacture of 3D mesostructures is receiving rapidly increasing attention, because of the fundamental significance and practical applications across wide-ranging areas. The recently developed approach of buckling-guided assembly allows deterministic formation of complex 3D mesostructures in a broad set of functional materials, with feature sizes spanning nanoscale to centimeter-scale. Previous studies mostly exploited mechanically controlled assembly platforms using elastomer substrates, which limits the capabilities to achieve on-demand local assembly, and to reshape assembled mesostructures into distinct 3D configurations. This work introduces a set of design concepts and assembly strategies to utilize dielectric elastomer actuators as powerful platforms for the electro-mechanically controlled 3D assembly. Capabilities of sequential, local loading with desired strain distributions allow access to precisely tailored 3D mesostructures that can be reshaped into distinct geometries, as demonstrated by experimental and theoretical studies of30 examples. A reconfigurable inductive–capacitive radio-frequency circuit consisting of morphable 3D capacitors serves as an application example.
引用
收藏
页码:342 / 354
页数:13
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