Materials for high-temperature digital electronics (vol 9, pg 790, 2024)

被引：0

作者：

Pradhan, Dhiren K. ^{[1
]}

Moore, David C. ^{[2
]}

Francis, A. Matt ^{[3
]}

Kupernik, Jacob ^{[3
]}

Kennedy, W. Joshua ^{[2
]}

Glavin, Nicholas R. ^{[2
]}

Olsson III, Roy H. ^{[1
]}

Jariwala, Deep ^{[1
]}

机构：

[1] Univ Penn, Dept Elect & Syst Engn, Philadelphia, PA 19104 USA

[2] Air Force Res Lab, Mat & Mfg Directorate, Dayton, OH USA

[3] Ozark Integrated Circuits, Fayetteville, AR USA

来源：

NATURE REVIEWS MATERIALS | 2025年 / 10卷 / 03期

关键词：

D O I：

10.1038/s41578-025-00789-z

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：243 / 243

页数：1

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