共 50 条
- [21] Layer Assignment for Maximizing The Reliability of 3D ICs 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 353 - 356
- [22] 3D Floorplanning with Nets-to-TSVs Assignment 2014 21ST IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS (ICECS), 2014, : 578 - 581
- [23] An Assignment Walk through 3D NMR Spectrum CIBCB: 2009 IEEE SYMPOSIUM ON COMPUTATIONAL INTELLIGENCE IN BIOINFORMATICS AND COMPUTATIONAL BIOLOGY, 2009, : 215 - 219
- [25] Disaster Planning and Response for Libraries. 3d ed JOURNAL OF ACADEMIC LIBRARIANSHIP, 2012, 38 (05): : 317 - 317
- [28] MerlinEM, the universal detector for 4D STEM and 3D ED ACTA CRYSTALLOGRAPHICA A-FOUNDATION AND ADVANCES, 2024, 80
- [29] A 3D Skeletonization Algorithm for 3D Mesh Models Using a Partial Parallel 3D Thinning Algorithm and 3D Skeleton Correcting Algorithm APPLIED SCIENCES-BASEL, 2017, 7 (02):