Reliability of gold wire leads for MEMS gyroscopes under a thermo-mechanical coupling field

被引:0
|
作者
Xu, Yingyu [1 ,2 ]
He, Chunhua [1 ]
Huang, Qinwen [2 ]
Yan, Guizhen [3 ]
机构
[1] Guangdong Univ Technol, Sch Comp, Guangzhou 510000, Peoples R China
[2] China Elect Prod Reliabil & Environm Testing Res, Sci & Technol Reliabil Phys & Applicat Technol El, Guangzhou 510000, Peoples R China
[3] Peking Univ, Inst Microelect, Natl Key Lab Sci & Technol Micro Nano Fabricat, Beijing 100871, Peoples R China
来源
2024 IEEE 19TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, NEMS 2024 | 2024年
基金
中国国家自然科学基金;
关键词
MEMS gyroscope; reliability; gold wire leads; thermo-mechanical coupling field;
D O I
10.1109/NEMS60219.2024.10639898
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this study, we investigate the vibration characteristics and failure modes of gold wire leads in MEMS gyroscopes under high-temperature and thermal-shock conditions through simulation and experimental analysis. The simulation results indicate a gradual degradation in the intrinsic frequencies of the leads as the temperature rises from -40 degrees C to 120 degrees C. The simulation results are verified by testing the intrinsic frequency with a percentage error of less than 2%. The average temperature drift of the intrinsic frequency is approximately -8.82 Hz/degrees C. When comparing the intrinsic frequency changes before and after burn-in and thermal-shock tests, it is evident that the mechanical degradation of the gold wire leads is limited under the severe thermo-mechanical coupling field, with frequency fluctuations ranging from 0.01% to 17%. There is no occurrence of a lead fracture or solder joint failure. The main failure modes are lead collapse and short-circuit failure due to the fatigue of long leads. Minimizing the span and height of the leads can reduce the risk of fatigue and short-circuit failures.
引用
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页数:4
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