Compact Ultra-Wideband On-Chip Bandpass Filter In Through Silicon Via Technology

被引：0
|
作者：
Liu, Nuo [1 ]
Liu, Xiaoxian [1 ]
Fan, Chenhui [1 ]
Zhu, Zhangming [1 ]
机构：
[1] Xidian Univ, Sch Microelect, Xian 710071, Peoples R China
来源：
2024 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY, ICMMT | 2024年
关键词：
3D inductor; UWB BPF; on-chip; equivalent circuit model;
D O I：
10.1109/ICMMT61774.2024.10672152
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A compact ultra-wideband (UWB) bandpass filter (BPF) with low insertion loss (IL) is demonstrated in this paper. The proposed filter is composed by the three dimensional (3D) inductors based on through silicon via (TSV) technology and metal wall capacitor. The equivalent circuit is proposed, simultaneously. The central frequency is 6.145 GHz with the IL of 0.11 dB. The fractional bandwidth is 171% and the core size of the UWB filter is 1.36 mmx1.74mm.
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页数：2
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