The analysis of IGBT module based on thermal simulation technology

被引：1

作者：

Liu, Jiahao ^{[1
]}

Zhang, Kun ^{[1
]}

Xiao, Hui ^{[1
]}

Zhu, Gang ^{[1
]}

Mao, Xingchao ^{[2
]}

Zhang, Weiwei ^{[2
]}

Chen, Fangzhou ^{[1
]}

Guo, Xiaotong ^{[1
]}

Liu, Hao ^{[3
]}

机构：

[1] China Elect Prod Reliabil & Environm Testing Res, Guangzhou, Peoples R China

[2] Harbin Inst Technol, Dept Mat Sci & Engn, Shenzhen, Peoples R China

[3] Beijing Santel Technol & Trading Corp, Beijing, Peoples R China

来源：

2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2022年

基金：

国家重点研发计划;

关键词：

Finite element analysis; Thermal simulation; IGBT module; Failure analysis; core-shell; reliability;

D O I：

10.1109/ICEPT56209.2022.9872705

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The failure analysis of IGBT modules based on thermal simulation technology is implemented. The thermal distributions of good and defective modules are revealed by using the Finite Element Method-based analytical software ANSYS. The results show that the highest temperature of a good module during operating is 154.3 degrees C. Meanwhile, that of the defective module is 162.7 degrees C, owing to the missing solder layer, which may cause the overheating failure of chips. Moreover, in order to improve the reliability of the solder layer, a novel preform based on Cu@Sn@Ag core-shell particles was adopted to interconnect the IGBT module. Compared with conventional solder, the preform has less porosity and higher flatness. In addition, the thermal simulation results show that compared with the conventional solder, the novel preform can reduce the working temperature by 1 degrees C.

引用

页数：3

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