3D printer audio and vibration side channel dataset for vulnerability research in additive manufacturing security

被引:0
|
作者
Madamopoulos, Christos [1 ,2 ]
Tsoutsos, Nektarios Georgios [1 ]
机构
[1] Univ Delaware, Dept Elect & Comp Engn, Newark, DE 19716 USA
[2] Natl Tech Univ Athens, Dept Elect & Comp Engn, Zografos, Greece
来源
DATA IN BRIEF | 2024年 / 57卷
基金
美国国家科学基金会;
关键词
Side channels; Side channel attacks; Additive manufacturing; 3D printing; Cyber physical systems; Cybersecurity;
D O I
10.1016/j.dib.2024.111002
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
This dataset provides a comprehensive set of side channels from fused deposition modeling 3D printers in order to enable the research in the security of additive manufacturing processes against side channel attacks. These attacks exploit indirect signal emanations from physical processes to extract information about a system. Our data was collected using two different methods (iPhone app and Teensy 4.0 sensor system) on two different 3D printers (Bambu Lab P1P and A1 mini), and consists of two types of data, audio data in the form of the recording of the 3D printer's sound while printing, and vibration data in the form of the linear acceleration in the cartesian coordinates. The dataset includes data from 12 different 3D objects that cover a wide variety of movements made while 3D printing. Along with the side channels this dataset includes the source computer-aided design files of the objects, as well as .gcode and .3mf files used by the printers. (c) 2024 The Author(s). Published by Elsevier Inc. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/)
引用
收藏
页数:19
相关论文
共 50 条
  • [21] Research on the Productivity of Desktop 3D Printer
    Huang, Zifan
    Li, Junmei
    Huang, Fangming
    Li, Ouyang
    Du, Mengfei
    Liu, Jun
    4TH INTERNATIONAL CONFERENCE ON APPLIED MATERIALS AND MANUFACTURING TECHNOLOGY, 2018, 423
  • [22] Security and Vulnerability Implications of 3D ICs
    Xie, Yang
    Bao, Chongxi
    Serafy, Caleb
    Lu, Tiantao
    Srivastava, Ankur
    Tehranipoor, Mark
    IEEE TRANSACTIONS ON MULTI-SCALE COMPUTING SYSTEMS, 2016, 2 (02): : 108 - 122
  • [23] The impact of vibration of the 3D printer table on the quality of print
    Pilch, Zbigniew
    Domin, Jaroslaw
    Szlapa, Andrzej
    2015 SELECTED PROBLEMS OF ELECTRICAL ENGINEERING AND ELECTRONICS (WZEE), 2015,
  • [25] 3D Printer-Manufacturing of Complex Geometry Elements
    Ciubara, A.
    Burlea, S. L.
    Axinte, M.
    Cimpoesu, R.
    Chicet, D. L.
    Manole, V.
    Burlea, G.
    Cimpoesu, N.
    EUROINVENT ICIR 2018, 2018, 374
  • [26] High-Resolution Additive Manufacturing of a Biodegradable Elastomer with A Low-Cost LCD 3D Printer
    Karamzadeh, Vahid
    Shen, Molly L.
    Ravanbakhsh, Hossein
    Sohrabi-Kashani, Ahmad
    Okhovatian, Sargol
    Savoji, Houman
    Radisic, Milica
    Juncker, David
    ADVANCED HEALTHCARE MATERIALS, 2024, 13 (09)
  • [27] Development of a pilot-scale HuskyJet binder jet 3D printer for additive manufacturing of pharmaceutical tablets
    Chang, Shing-Yun
    Jin, Jun
    Yan, Jun
    Dong, Xin
    Chaudhuri, Bodhisattwa
    Nagapudi, Karthik
    Ma, Anson W. K.
    INTERNATIONAL JOURNAL OF PHARMACEUTICS, 2021, 605
  • [28] Additive manufacturing of 3D batteries: a perspective
    Kai Narita
    Max A. Saccone
    Yuchun Sun
    Julia R. Greer
    Journal of Materials Research, 2022, 37 : 1535 - 1546
  • [29] Additive manufacturing for 3d electronic applications
    Maruo S.
    Maruo, Shoji, 1600, Japan Institute of Electronics Packaging (23): : 452 - 458
  • [30] 3D Antennas, Metamaterials, and Additive Manufacturing
    Zhang, Shiyu
    Cadman, Darren
    Whittow, Will
    Wang, Dawei
    Chi-Tangyie, George
    Ghosh, Avishek
    Ketharam, Annapoorani
    Goulas, Athanasios
    Reaney, Ian
    Vaidhyanathan, Bala
    Engstrom, Daniel
    Vardaxoglou, J. C.
    2019 IEEE MTT-S INTERNATIONAL WIRELESS SYMPOSIUM (IWS 2019), 2019,