Fine Pitch Flip Chip Bonding for Heterogeneous Chiplet Integration

被引：0

作者：

Oppermann, Hermann ^{[1
]}

Manier, Charles-Mix ^{[1
]}

Froehlich, Juliane ^{[1
]}

Schneider-Ramelow, Martin ^{[2
]}

机构：

[1] Fraunhofer IZM, Gustav Meyer Allee 25, D-13355 Berlin, Germany

[2] Tech Univ Berlin, Berlin, Germany

来源：

2024 IEEE 24TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY, NANO 2024 | 2024年

关键词：

D O I：

10.1109/NANO61778.2024.10628553

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silicon is the main working horse, but many chiplets are based on alternative semiconductors. For heterogeneous integration flip chip is a key technology, but due to CTE mismatch and material compatibility specific bump interconnects should be considered, which must also address challenges in fine pitch and precision bonding.

引用

页码：489 / 494

页数：6

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