Thermal Conductivity of 3D-Printed Metal Using Extrusion-Based Metal Additive Manufacturing Process

被引:0
|
作者
Khanafer, Khalil [1 ]
Abbasspour, Austin [1 ]
Aboelkassem, Yasser [1 ]
机构
[1] Univ Michigan, Coll Innovat & Technol, Div Engn Technol, Flint, MI 48502 USA
关键词
additive manufacturing; thermal conductivity; 3D-printing; extrusion-based metal; finite element analysis; materials processing; metals; COMPOSITES; GRAPHITE;
D O I
10.1115/1.4066639
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
In this study, the thermal conductivity of 3D-printed 316L stainless steel parts using the bound metal deposition (BMD) method, an extrusion-based 3D-printing technology, was examined experimentally and validated numerically using finite element analysis (FEA). Various critical printing parameters were examined, including infill density, skin overlap percentage, and print sequence to study their effect on the printed thermal conductivity. A heat conduction experiment was performed on the 3D-printed samples of 316L stainless steel followed by a FEA. The results from this investigation revealed that an increase in 3D-printing infill density correlated with a rise in effective thermal conductivity. Conversely, a substantial decrease in thermal conductivity was observed as porosity increased. For instance, at a porosity level of 16.5%, the thermal conductivity experienced a notable 33% reduction compared to the base material. The skin overlap percentage, which governs how much the outer shell of adjacent layers overlaps, was found to impact heat transfer across the overall part surface. A higher overlap percentage was associated with improved thermal conductivity, although it could affect the surface finish of the part. Furthermore, the study explored the print sequence, focusing on whether the outer wall or infill was printed first. Printing the outer wall first resulted in higher thermal conductivity values than that obtained from printing the infill first. Therefore, it is crucial to carefully consider these factors during the BMD 3D-printing process to achieve the desired thermal conductivity properties.
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页数:8
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