Fluidic Self Alignment for Hybrid Bonding Using Intel Process

被引：0

作者：

Eid, Feras ^{[1
]}

Shi, Y. ^{[2
]}

Naderi, G. ^{[1
]}

Sinha, S-B ^{[1
]}

Jordan, R. ^{[1
]}

Li, W. ^{[1
]}

El Helou, C. ^{[1
]}

Bedoya, F. ^{[1
]}

Roy, A. ^{[1
]}

Mandi, T. ^{[1
]}

Chen, J-R ^{[1
]}

Rawlings, B. ^{[1
]}

Barley, B. ^{[1
]}

Benson, S. ^{[2
]}

Zandavi, H. ^{[2
]}

Baker, M. ^{[2
]}

Myers, P. ^{[2
]}

Allen, M. ^{[2
]}

Lopez, A. ^{[2
]}

Saucedo, J. ^{[2
]}

Minn, K. ^{[2
]}

Dong, S. ^{[2
]}

Bielefeld, J. ^{[1
]}

Vreeland, R. ^{[1
]}

Brezinski, W. ^{[1
]}

Olmos, F. ^{[2
]}

Woods, C. ^{[2
]}

Swan, J. ^{[1
]}

机构：

[1] Intel Corp, Components Res, Santa Clara, CA 95052 USA

[2] Intel Corp, Assembly & Test Technol Dev, Santa Clara, CA 95052 USA

来源：

PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024 | 2024年

关键词：

hybrid bonding; self assembly; capillary; fluidic alignment; high throughput;

D O I：

10.1109/ECTC51529.2024.00347

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Scaling of die-to-wafer hybrid bonding to realize finer interconnects and greater disaggregation requires new solutions for fast bonding with precise alignment. This paper presents fluidic self alignment as a promising approach that can enable better alignment than today's solutions with over 10x increase in throughput. Modeling is carried out to quantify the physics, and a new Intel process is developed to fabricate wafers with self alignment features, demonstrating successful liquid confinement. This is followed by assembly experiments which bring down the die-to-wafer misalignment from over 50 um to less than 0.2 um after fluidic self alignment at specific conditions. Next steps to improve the modeling and the process are outlined.

引用

页码：2037 / 2041

页数：5

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