Development of microcapsule-based self-healing composite: A critical review on influencing factors of microencapsulation, healing efficiency, thermal stability and application

被引:0
|
作者
Adil, Md. Mahmudul [1 ,2 ]
Rabbi, M. S. [2 ]
Tasnim, Tasfia [1 ,2 ]
机构
[1] Bangladesh Army Univ Sci & Technol, Dept Mech Engn, Saidpur 5311, Bangladesh
[2] Chittagong Univ Engn & Technol, Dept Mech Engn, Chittagong 4349, Bangladesh
关键词
Microcapsule; Self-healing System; Thermal stability; Healing efficiency; Application; TOUGHENED EPOXY COMPOSITE; LINSEED OIL; CORROSION PERFORMANCE; MECHANICAL-PROPERTIES; POLYMERIC MATERIALS; FATIGUE CRACKS; IMPACT DAMAGE; PART II; COATINGS; RESIN;
D O I
10.1016/j.aej.2025.02.092
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The utilization of composite materials has experienced a notable rise in recent years due to their advantageous combination of lightweight properties, exceptional strength, and high stiffness. But this type of materials when used to build complex structure can encounter mechanical and thermal damage in a form of microcrack which later causes the failure of materials if repair is impossible. Hence, self-healing of those materials can solve the problem along with minimizing the maintenance cost and keeping the structure safe and sound. The purpose of this state-of-the-art review is to investigate the advancements of microcapsule-based self-healing composite materials. The present study provides a comprehensive discussion on various types of self-healing systems based on microcapsules. These systems include the Dual/multi-microcapsules system, Microcapsules-latent curing agent system, Microcapsule-catalyst System. Each system is examined in detail to understand its unique characteristics and potential applications in self-healing materials. This paper aims to analyze various factors that contribute to the process of microencapsulation, as well as their impact on healing efficiency and thermal stability. The discussion focuses on the broad application of microcapsule-based self-healing composites in various fields.
引用
收藏
页码:1 / 17
页数:17
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