Antenna-in-Package of Lateral Cross-Dipole Elements for Endfire Dual-Polarized Radiation at Dual Millimeter-Wave Frequency Bands for 5G FR2 User Equipment Applications

被引:1
|
作者
Chou, Hsi-Tseng [1 ]
Yan, Zhi-Da [1 ]
机构
[1] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei 10617, Taiwan
关键词
Metals; Microstrip; Dipole antennas; Dual band; Substrates; Microstrip antenna arrays; Antennas; Antenna radiation patterns; Dielectric substrates; Baluns; Antenna array; antenna-in-package (AiP); dipole antennas; dual band; dual polarization; endfire radiation; low-temperature co-fired ceramics (LTCCs); multilayer substrates; ARRAY ANTENNA; PHASED-ARRAY; BASE STATION; SLOT ANTENNA; PERFORMANCE; DESIGN; CHIP;
D O I
10.1109/TAP.2024.3494048
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A dual-band and dual-polarized antenna-in-package (AiP) design is proposed for 5G user equipment (UE) applications in the 28- and 38-GHz bands. The AiP design incorporates lateral cross-dipole elements to produce endfire radiation with dual-polarized, fan-shaped patterns for UE applications with dynamic orientations. The AiP prototype is fabricated for heat handling enhancement using the low-temperature co-fired ceramics (LTCCs) process. It stacks 14 thin dielectric substrates to form a 3-D radiator architecture on the intersubstrate interfaces. The AiP employs multiple antenna elements to achieve 1-D beam steering. Each lateral cross-dipole pair combines horizontally oriented dipole arms with vertical parallel plates to generate dual polarizations. Full-wave simulations indicate an approximate gain of 4 dBi for each antenna element, with broad and fan-shaped radiation patterns. These findings have been further validated through measurements conducted on an antenna prototype.
引用
收藏
页码:74 / 86
页数:13
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