Enhanced mechanical, tribological, and thermal properties of copper-graphene composites using additive manufacturing

Composite materials have the potential to enhance material properties, presenting compelling opportunities for diverse engineering applications. However, the 3D printing of composite materials poses challenges such as material compatibility, second phase dispersion, adhesion bonding, and printability issues, primarily arising due to reinforcing agent. Copper-based immiscible system possesses great potential for their excellent structural and functional properties. Therefore, in this study Copper-Graphene immiscible metal matrix composites were successfully fabricated using direct ink writing methodology. This method involves formulation of Copper-graphene ink utilizing biodegradable cellulose hydrogel and copper powder. Ink formulation and its rheological properties are analysed for this study at the ambient temperature. Direct ink printed Copper-Graphene immiscible composites were sintered at 950 degrees C followed by comprehensive assessments of morphology of printed objects, dispersion of Graphene through direct ink writing in the Cu matrix, mechanical strength of printed object, and wear characteristics, thermal conductivity. This study highlights the potential applications of copper-graphene metal matrix composites and explores the challenges related to their use in 3D printing.