共 33 条
- [4] Low Temperature Thermocompression Bonding Based on Copper Nanostructure for 3D Packaging 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 57 - 60
- [10] Bonding Based Channel Transfer and Low Temperature Process for Monolithic 3D Integration Platform Development 2016 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2016,