Solid-State Bonding with SAC305 Sheets for Direct Cooling

被引：0
|
作者：
Jo, Eunjin [1 ,2 ]
Kim, YehRi [1 ,3 ]
Park, Young-Bae [2 ]
Kim, Dongjin [1 ]
机构：
[1] Korea Institute Of Industrial Technology (KITECH), Micro-Joining Center, Incheon, Korea, Republic of
[2] School Of Materials Science And Engineering, Andong National University, Andong, Korea, Republic of
[3] School Of Electrical Engineering, Graduate School, Korea University, Seoul, Korea, Republic of
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Diffusion bonding - Electronics packaging - Wafer bonding
引用
收藏
页码：147 / 148
相关论文
共 50 条
  • [21] Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulation and mechanical property
    Liu, Di
    Bai, Tianyue
    Qiao, Yuanyuan
    Ma, Haoran
    Dong, Wei
    Zhao, Ning
    MATERIALS CHARACTERIZATION, 2024, 215
  • [22] MODELING SOLID-STATE DIFFUSION BONDING
    HILL, A
    WALLACH, ER
    ACTA METALLURGICA, 1989, 37 (09): : 2425 - 2437
  • [23] Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints
    Deshpande, Abhishek
    Jiang, Qian
    Dasgupta, Abhijit
    Becker, Ulrich
    JOURNAL OF ELECTRONIC PACKAGING, 2022, 144 (03)
  • [24] Ag–(In–Bi) solid-state bonding
    Stéphane Léonard Kuziora
    Hoang-Vu Nguyen
    Knut Eilif Aasmundtveit
    Journal of Materials Science: Materials in Electronics, 2023, 34
  • [25] SOLID-STATE BONDING OF MOLYBDENUM AND TZM
    MAYER, HG
    HAUFLER, G
    PLANSEEBERICHTE FUR PULVERMETALLURGIE, 1978, 26 (03): : 157 - 171
  • [26] Modelling solid-state diffusion bonding
    Hill, A., 1600, (37):
  • [27] Effects of Cu foam on microstructure and mechanical properties of SAC305 solder joints bonded with solid-liquid electromigration
    Hu, Xiaowu
    Zhang, Zezong
    Chen, Wenjing
    Mao, Xin
    Ma, Yan
    Xiao, Shikun
    Huang, Hai
    Wang, Jue
    Chen, Bin
    Li, Qinglin
    Jiang, Xiongxin
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 34 (11)
  • [28] Solid-State Cooling, Part I
    Dieckmann, John
    Cooperman, Alissa
    Brodrick, James
    ASHRAE JOURNAL, 2011, 53 (03) : 82 - 84
  • [29] Nanoscale solid-state cooling: a review
    Ziabari, Amirkoushyar
    Zebarjadi, Mona
    Vashaee, Daryoosh
    Shakouri, Ali
    REPORTS ON PROGRESS IN PHYSICS, 2016, 79 (09)
  • [30] Solid-state refrigeration for cooling microprocessors
    Ramanathan, S
    Chrysler, GM
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (01): : 179 - 183
12345