Exploring Machine Learning for Semiconductor Process Optimization: A Systematic Review

被引:1
|
作者
Chen Y.
Sacchi S.
Dey B.
Blanco V.
Halder S.
Leray P.
De Gendt S.
机构
[1] Imec, Angstrom Patterning Department, Leuven,3001, Belgium
[2] KU Leuven, Department of Materials Engineering, Department of Chemistry, Leuven,3001, Belgium
来源
关键词
Advanced Process Control; Artificial Intelligence; Chemical Mechanical Polishing; Data models; Deep Learning; Etching; Lithography; Machine Learning; Machine learning; Metrology; Neural Networks; Predictive Metrology; Process control; Reviews; Root Cause Analysis; Scatterometry; Semiconductor device manufacture; Semiconductor Manufacturing; Semiconductor process modeling; Semiconductor Process Optimization; Thin film; Virtual Metrology;
D O I
10.1109/TAI.2024.3429479
中图分类号
学科分类号
摘要
As machine learning continues to find applications, extensive research is currently underway across various domains. This study examines the current methodologies of machine learning being investigated to optimize semiconductor manufacturing processes. Our research involved searching the SPIE Digital Library, IEEE Xplore, and ArXiv databases, identifying 58 publications in the field of machine learning-based semiconductor process optimization. These investigations employ machine learning techniques such as feature extraction, feature selection, neural network architecture, and are analyzed using different algorithms. These models find applications in advanced process control, virtual metrology, and quality control, critical aspects in semiconductor manufacturing for enhancing throughput and reducing production costs. We categorize the papers based on the methods and applications employed, summarizing the primary findings. Furthermore, we discuss the general conclusions of several studies. Overall, the reviewed literature suggests that machine learning-based semiconductor manufacturing is rapidly gaining popularity and advancing at a swift pace. IEEE
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页码:1 / 21
页数:20
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