Influence of Ta2O5 crystallization on the performance of capacitors for high-density DRAMs

被引:0
|
作者
Furukawa, R. [1 ]
Kanda, N. [1 ]
Yamamoto, H. [1 ]
Yoshida, T. [1 ]
Yamagami, N. [1 ]
Uemura, T. [1 ]
Honma, T. [1 ]
Kanai, M. [1 ]
Kunitomo, M. [1 ]
Takahashi, M. [1 ]
Uchiyama, H. [1 ]
Ohji, Y. [1 ]
机构
[1] Hitachi, Ltd, Tokyo, Japan
关键词
Capacitance - Capacitors - Crystallization - Dielectric films - Dynamic random access storage - Grain growth - Thin film devices - X ray crystallography;
D O I
暂无
中图分类号
学科分类号
摘要
The capacitance needed for the long refresh time of high-density DRAMs can be obtained by using a Ta2O5 capacitor. We found that the electrical characteristics of this capacitor are strongly related to the crystallization of Ta2O5 thin films. Accordingly, we found that a Ta2O5 crystal with a low intensity ratio (I200/I001) surprisingly improves the electrical characteristics of the Ta2O5 capacitor. Our technique for controlling grain growth in the Ta2O5 film formation improves the electrical characteristics of a Ta2O5 capacitor considerably.
引用
收藏
页码:249 / 252
相关论文
共 50 条
  • [1] PROMISING STORAGE CAPACITOR STRUCTURES WITH THIN TA2O5 FILM FOR LOW-POWER HIGH-DENSITY DRAMS
    SHINRIKI, H
    KISU, T
    KIMURA, S
    NISHIOKA, Y
    KAWAMOTO, Y
    MUKAI, K
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1990, 37 (09) : 1939 - 1947
  • [2] Characterization of Ta2O5 thin films with small current leakage for high density DRAMs
    Kanda, N
    Furukawa, R
    Ishibashi, M
    Kunitomo, M
    Homma, T
    Takahashi, M
    Uemura, T
    Kanai, M
    Kubo, M
    Ogata, K
    Yoshida, T
    Yamamoto, H
    Ohji, Y
    STRUCTURE AND ELECTRONIC PROPERTIES OF ULTRATHIN DIELECTRIC FILMS ON SILICON AND RELATED STRUCTURES, 2000, 592 : 129 - 134
  • [3] INFLUENCE OF SIO2 AT THE TA2O5/SI INTERFACE ON DIELECTRIC CHARACTERISTICS OF TA2O5 CAPACITORS
    NISHIOKA, Y
    SHINRIKI, H
    MUKAI, K
    JOURNAL OF APPLIED PHYSICS, 1987, 61 (06) : 2335 - 2338
  • [4] Breakdown fields and conduction mechanisms in thin Ta2O5 layers on Si for high density DRAMs
    Atanassova, E
    Paskaleva, A
    MICROELECTRONICS RELIABILITY, 2002, 42 (02) : 157 - 173
  • [5] Challenges of Ta2O5 as high-k dielectric for nanoscale DRAMs
    Atanassova, E.
    Paskaleva, A.
    2006 25TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS, 2006, : 47 - +
  • [6] Challenges of Ta2O5 as high-k dielectric for nanoscale DRAMs
    Atanassova, E.
    Paskaleva, A.
    MICROELECTRONICS RELIABILITY, 2007, 47 (06) : 913 - 923
  • [7] High-quality ultrathin chemical-vapor-deposited Ta2O5 capacitors prepared by high-density plasma annealing
    Liu, CH
    Chang, SJ
    Chen, JF
    Chen, SC
    Lee, JS
    Liaw, UH
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2004, 106 (03): : 234 - 241
  • [8] Influence of the metal electrode on the characteristics of thermal Ta2O5 capacitors
    Atanassova, E.
    Spassov, D.
    Paskaleva, A.
    MICROELECTRONIC ENGINEERING, 2006, 83 (10) : 1918 - 1926
  • [9] Ti doped Ta2O5 stacked capacitors
    Atanassova, E.
    Spassov, D.
    Paskaleva, A.
    Georgieva, M.
    Koprinarova, J.
    JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2009, 11 (10): : 1509 - 1512
  • [10] VARIATION OF CONDUCTIVITY OF TA2O5 IN ELECTROLYTIC CAPACITORS
    BURNHAM, J
    IEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGING, 1966, PMP2 (04): : 114 - &