Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements

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[1] Yu, D.Q.
[2] Zhao, J.
[3] Wang, L.
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Wang, L. (wangl@dlut.edu.cn) | 1600年 / Elsevier Ltd卷 / 376期
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