HOW TO PREVENT THERMAL SHOCK USING TEMPERATURE SOLDERING.

被引：0
|
作者：
Burley, James [1 ]
机构：
[1] Hollis Automation Inc, Nashua, NH,, USA, Hollis Automation Inc, Nashua, NH, USA
来源：
Electri-onics | 1987年 / 33卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：23 / 33
相关论文
共 50 条
  • [21] A Study on Novel Low Temperature Soldering Process using Vapor phase
    Kim, Youngja
    Choi, Woojin
    Oh, Seungyeop
    Lee, Sinyeop
    Kang, Sunwon
    PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 2091 - 2095
  • [22] Using Thermal Shock to Transform Thermal Energy Into Work
    Tileubay, Zhengis
    JOURNAL OF ENERGY RESOURCES TECHNOLOGY-TRANSACTIONS OF THE ASME, 2020, 142 (08):
  • [23] Development of abnormal facial temperature detection technology using thermal imaging to prevent the spread of infectious diseases
    Hong, Hyung Gil
    Jang, Sun Ho
    Yun, Hae Yong
    Cho, Yong Jun
    JOURNAL OF KING SAUD UNIVERSITY-COMPUTER AND INFORMATION SCIENCES, 2023, 35 (09)
  • [24] SURFACE TEMPERATURE THERMAL FLUXMETERS FOR SHOCK-TUBES
    MAULARD, J
    RECHERCHE AEROSPATIALE, 1968, (126): : 39 - &
  • [25] SHOCK-INDUCED TEMPERATURE AND THERMAL-CONDUCTIVITY
    HARRIS, P
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1975, 20 (11): : 1436 - 1436
  • [26] Prognostic and informative value of temperature gradients in thermal shock
    Taneva, EK
    INTENSIVE CARE MEDICINE, 2003, 29 : S114 - S114
  • [27] Temperature cycling and thermal shock failure rate modeling
    Blish, RC
    1997 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 35TH ANNUAL, 1997, : 110 - 117
  • [28] Pyrometric temperature measurement of ceramic thermal shock samples
    Pulz, R.
    Rehmer, B.
    Skrotzki, B.
    MEASUREMENT, 2011, 44 (01) : 259 - 266
  • [29] Modeling the temperature shock of elastic elements using a one-dimensional model of thermal conductivity
    Belousova, D. A.
    Serdakova, V. V.
    INTERNATIONAL JOURNAL OF MODELING SIMULATION AND SCIENTIFIC COMPUTING, 2020, 11 (06)
  • [30] Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn-Al system solders
    Nagaoka, Toru
    Morisada, Yoshiaki
    Fukusumi, Masao
    Takemoto, Tadashi
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2011, 211 (09) : 1534 - 1539
12345