Particle adhesion and removal in electrophotography

被引：0
|
作者：
机构：
[1] Rimai, D.S.
[2] Weiss, D.S.
[3] Quesnel, D.J.
来源：
Rimai, D.S. (donald_rimai@nexpress.com) | 1600年 / VSP BV卷 / 17期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [11] Influence of removal time and particle size on the particle substrate adhesion force
    Felicetti, M. A.
    Piantino, F.
    Coury, J. R.
    Aguiar, M. L.
    BRAZILIAN JOURNAL OF CHEMICAL ENGINEERING, 2008, 25 (01) : 71 - 82
  • [12] PARTICLE ADHESION AND REMOVAL IN WELL DEFINED MODEL SYSTEMS
    MATIJEVIC, E
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1981, 182 (AUG): : 39 - COLL
  • [13] PARTICLE ADHESION AND REMOVAL IN ETHANOL-WATER MIXTURES
    GOTOH, K
    KAKO, C
    YOSHIMURA, T
    TAGAWA, M
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1993, 7 (05) : 467 - 479
  • [14] Particle adhesion and removal mechanisms during brush scrubber cleaning
    Xu, K
    Vos, R
    Vereecke, G
    Doumen, G
    Fyen, W
    Mertens, PW
    Heyns, MM
    Vinckier, C
    Fransaer, J
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (06): : 2844 - 2852
  • [15] PARTICLE ADHESION AND REMOVAL IN MODEL SYSTEMS .10. THE EFFECT OF ELECTROLYTES ON PARTICLE DETACHMENT
    KALLAY, N
    BISKUP, B
    TOMIC, M
    MATIJEVIC, E
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 1986, 114 (02) : 357 - 362
  • [16] PARTICLE ADHESION AND REMOVAL IN MODEL SYSTEMS .5. INTERPRETATION OF THE KINETICS OF PARTICLE DETACHMENT
    NELLIGAN, JD
    KALLAY, N
    MATIJEVIC, E
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 1982, 89 (01) : 9 - 15
  • [17] Characteristics of adhesion and removal of suspended particle in liquid by bubble - Effect of particle contact angle
    Arai, Hirotada
    Iida, Naomi
    Matsumoto, Katsittoshi
    Taniguchi, Shoji
    Nakaoka, Takehiro
    Kunji, Kazittaka
    Sakamoto, Koichi
    TETSU TO HAGANE-JOURNAL OF THE IRON AND STEEL INSTITUTE OF JAPAN, 2007, 93 (01): : 1 - 8
  • [18] Particle adhesion and removal on EUV mask layers during wet cleaning
    Lee, SH
    Hong, YK
    Song, JH
    Park, JG
    Busnaina, AA
    Zhang, GJ
    Eschbach, F
    Ramamoorthy, A
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (7B): : 5479 - 5483
  • [19] Particle adhesion and removal on EUV mask layers during wet cleaning
    Lee, S.-H., 1600, (Japan Society of Applied Physics):
  • [20] Particle adhesion and removal mechanisms in post-CMP cleaning processes
    Busnaina, AA
    Lin, H
    Moumen, N
    Feng, JW
    Taylor, J
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2002, 15 (04) : 374 - 382
12345