PYROPHOSPHATE COPPER PLATING IN PRINTED CIRCUIT MANUFACTURE.

被引：0
|
作者：
Strickland, G.R.
机构：
来源：
Product Finishing (London) | 1972年 / 25卷 / 04期
关键词：
COPPER PLATING;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The various stages of obtaining a plating system are described and explained, which would meet several deposit characteristics, namely as near as possible a 1:1 board-to-hole plated thickness ratio. Sufficient ductility to withstand the thermal shock of dip soldering, and to withstand rigours of thermal cycling, vibration and mechanical shock. Many thousands of square feet of copper have been continuously plated in the six production copper plating installations at Transmetrix Electronic Systems Ltd, Shanklin, without the slightest trace of corner or barrel cracking being recorded by either the control laboratory or the customer.
引用
收藏
页码：20 / 24
相关论文
共 50 条
  • [31] TRACK MANUFACTURE.
    Alias, Jean
    Cantenot, Jean
    1983, (01):
  • [32] Integrated Manufacture.
    Farkas, J.
    Fertigung, 1976, 7 (03): : 85 - 89
  • [33] LUSTROUS COPPER PLATING FROM A PYROPHOSPHATE ELECTROLYTE
    POPOVICH, VA
    GERASIMOV, VV
    GRISHCHUK, VI
    NOSOVA, TV
    LOSHKAREV, MA
    PROTECTION OF METALS, 1985, 21 (01): : 124 - 126
  • [34] THE DETERMINATION OF AMMONIA IN COPPER PYROPHOSPHATE PLATING SOLUTION
    TAM, TM
    ZEVELY, JS
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (01) : 109 - 111
  • [35] Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards
    Laine-Ma, Teija
    Ruuskanen, Pekka
    Kortet, Satu
    Karttunen, Mikko
    CIRCUIT WORLD, 2009, 35 (04) : 22 - 30
  • [36] Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles
    Cobley, A. J.
    Comeskey, D. J.
    Paniwnyk, L.
    Mason, T. J.
    CIRCUIT WORLD, 2010, 36 (03) : 9 - 13
  • [37] Influence of parameters of bidirectional pulse power supply on copper plating on printed circuit board
    Wang, Shoutao
    Chen, Wenguang
    Liu, Zhijian
    Wei, Caiyi
    Peng, Yuanyuan
    2022 9TH INTERNATIONAL FORUM ON ELECTRICAL ENGINEERING AND AUTOMATION, IFEEA, 2022, : 76 - 80
  • [38] INTEGRATING DEVELOPMENT AND MANUFACTURE.
    McLeod, Tom
    Systems Technology, 1981, (33): : 38 - 42
  • [39] SUPERALLOYS: METALLURGY AND MANUFACTURE.
    Kear, Bernard H.; Muzyka, D.R.; Tien, John K.; Wlodek, S.T., 1600, Claitor's Publ Div, Baton Rouge, La
  • [40] Fixation of Activation Nuclei During Fully Additive Circuit Board Manufacture.
    Gemmler, A.
    Jostan, J.L.
    Ostwald, R.
    Bogenschuetz, A.F.
    MO Metalloberflache Beschichten von Metall und Kunststoff, 1984, 38 (10): : 435 - 438
12345