PYROPHOSPHATE COPPER PLATING IN PRINTED CIRCUIT MANUFACTURE.

The various stages of obtaining a plating system are described and explained, which would meet several deposit characteristics, namely as near as possible a 1:1 board-to-hole plated thickness ratio. Sufficient ductility to withstand the thermal shock of dip soldering, and to withstand rigours of thermal cycling, vibration and mechanical shock. Many thousands of square feet of copper have been continuously plated in the six production copper plating installations at Transmetrix Electronic Systems Ltd, Shanklin, without the slightest trace of corner or barrel cracking being recorded by either the control laboratory or the customer.