A method is described which allows electrical measurements of sensitive circuits without contact. The testing of microscopic electronic circuits, present on current generation chips, is usually a complicated process. It is generally not feasible to contact the circuit elements directly with probes because of the possibility of introducing impurities, physical damage to the circuit, and due to the extremely minute size of the circuit components. For the purposes of this invention, areas which are desired to have the field emission structures could be 'seeded with low impurity levels by a deposition process using standard photolithographic techniques.