Crack mechanism in wire bonding joints

被引：0

作者：

Ramminger, S. ^{[1
]}

Tuerkes, P. ^{[1
]}

Wachutka, G. ^{[1
]}

机构：

[1] Siemens AG, Munich, Germany

来源：

Microelectronics Reliability | 1998年 / 38卷 / 6-8期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：1301 / 1305

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