SCOPE LAYOUT INCREASES CIRCUIT DENSITY.

被引：0

作者：

Bilterijst, Jan ^{[1
]}

van Gorsel, Jan ^{[1
]}

机构：

[1] Philips Test & Measurement, Enschede, Neth, Philips Test & Measurement, Enschede, Neth

来源：

Electronic Packaging and Production | 1987年 / 27卷 / 02期

关键词：

INTEGRATED CIRCUITS - Layout - OSCILLOSCOPES; CATHODE RAY - Design;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Increasing the packaging density in electronic instruments requires matching the circuitry to the application while ensuring maximum reliability. This article discusses how maximum packaging density and reliable electrical performance was achieved by use of thin-film hybrids and surface-mounted discrete chip components.

引用

页码：116 / 117

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