Wafer level packaging for CSPs

被引：0
|
作者：
Hou, Michelle [1 ]
机构：
[1] Fujitsu Microelectronics Inc, San Jose, United States
来源：
Semiconductor International | 1998年 / 21卷 / 08期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：305 / 306
相关论文
共 50 条
  • [1] Wafer-level CSPs fabbed without wafer modification
    不详
    SOLID STATE TECHNOLOGY, 1999, 42 (07) : 32 - +
  • [2] Wafer Level Camera Technology - from Wafer Level Packaging to Wafer Level Integration
    Han, Hongtao
    Kriman, Moshe
    Boomgarden, Mark
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 121 - 124
  • [3] Wafer-level packaging
    Van Driel, Willem Dirk
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (03): : 358 - 358
  • [4] Wafer level packaging of MEMS
    Esashi, Masayoshi
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (07)
  • [5] HMIC Wafer Level Packaging
    Boles, Timothy
    Hoag, David
    Barter, Margaret
    Giacchino, Richard
    Hogan, Paul
    Goodrich, Joel
    2009 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC 2009), 2009, : 423 - 426
  • [6] HMIC Wafer Level Packaging
    Boles, Timothy
    Hoag, David
    Barter, Margaret
    Giacchino, Richard
    Hogan, Paul
    Goodrich, Joel
    2009 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2009, : 1776 - 1779
  • [7] Wafer Bumping & Wafer Level Packaging for 300mm Wafer
    Oppert, Thomas
    Zakel, Elke
    Teutsch, Thorsten
    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 42 - 42
  • [8] Material challenges for wafer level packaging
    Ma, BD
    Zhang, E
    Hong, SH
    Tong, Q
    Savoca, A
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 68 - 73
  • [9] Future wafer level CSP packaging
    Simon, J
    2ND 1998 IEMT/IMC SYMPOSIUM, 1998, : 30 - 34
  • [10] Wafer-level packaging and test
    Gilg, Larry
    Advanced Packaging, 2002, 11 (11): : 35 - 38
12345