Direct bonding of copper to aluminum nitride

被引：0
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作者：
Entezarian, M. [1 ]
Drew, R.A.L. [1 ]
机构：
[1] McGill Univ, Montreal, Canada
来源：
Materials Science and Engineering A | 1996年 / A212卷 / 02期
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页码：206 / 212
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